3D Reconstruction Intern
Hybrid
Internship
#Engineering
#3D
#Computer Vision
#Python
#Signal Processing
#Systems
At Array Labs we are building a distributed radar imaging constellation that will deliver the first accurate, real-time 3D model of Earth. Our formation-flying satellites give us a completely new way to observe our planet, and we are looking for a 3D Reconstruction Intern who wants to help turn raw satellite measurements into that living, high-resolution model.
What you'll be doing
- Design and implement algorithms that turn multi-view satellite data into accurate 3D reconstructions, advancing our work in computer vision, tomography, and interferometry.
- Process and analyze the resulting 3D datasets so they can be used effectively by downstream teams and applications.
- Work side-by-side with mentors and engineers to integrate your solutions into our production pipeline, documenting progress and presenting findings to the wider team throughout the internship.
What you'll bring
- Current enrollment in an advanced degree program in Computer Science, Electrical Engineering, or a closely related field; exceptionally motivated juniors and seniors are also welcome to apply.
- Coursework or hands-on projects in signal processing, computer vision, multi-view geometry, 3D reconstruction, or radar systems, backed by a strong academic foundation in at least one of these areas.
- Programming experience in Python and a solid grasp of core software-development practices such as version control, testing, and debugging.
- The ability to work both independently and collaboratively, paired with clear written and verbal communication skills.
- English proficiency for day-to-day technical discussions and documentation.
Preferred experience includes prior internships or research in radar systems, image processing, or computer vision; familiarity with GPU programming; and exposure to geospatial applications or radar imaging.
What you'll get
- Hybrid work that blends time in our office with the flexibility to work from home.




